The Shellcase MVP solution addresses market demand for more advanced technologies in image sensor packaging, including a thinner package, higher yield, enhanced reliability and lower cost. The new technology provides manufacturers with the ability to develop thinner, more sophisticated consumer devices faster at a lower overall cost. The Shellcase MVP solution also enables manufacturers to utilize image sensor wafers without requiring any chip design modification, providing additional time and cost savings.
The Shellcase MVP solution targets original equipment manufacturers (OEMs) and camera module manufacturers building lower profile, thinner and more sophisticated consumer devices for camera phones, digital cameras, PDAs and laptops, as well as digital scanners and fingerprint identification devices. Compliance with JEDEC Level 1 moisture sensitivity requirements also makes the new technology suitable for automotive and other market segments which require higher reliability.
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