TriQuint Semiconductor Unveils 2 HV-HBT Devices

Jun 23, 2008 (AIRLINE INDUSTRY INFORMATION via COMTEX) -- WJCI | Quote | Chart | News | PowerRating -- TriQuint Semiconductor, an RF semiconductor manufacturer and foundry services provider, announced the release of two HV-HBT (high voltage-heterojunction bipolar transistor) devices created at TriQuint's San Jose, CA design center, formerly WJ Communications.

The company said the linear devices expand TriQuint's HV-HBT portfolio, and when paired with TriQuint's HBT devices, provide an RF solution for 3G/4G amplifier (HPA) mobile infrastructure designs.

An important customer advantage of the recent WJ Communications acquisition is the ability of the companies' portfolios to complement each other, remarked TriQuint Product Marketing Director, Dan Green. WJ's device line-up complements our base station portfolio very well. WJ's expertise in InGaP HBT technology and the new devices' excellent linearity, paired with TriQuint's high power, highly efficient and highly linear HBT devices offer a complete RF transistor solution.

GSM system amplifiers (2G) don't require linear operation, and their efficiencies were much higher because of this fact. But next-generation 3G/4G systems demand linearity and efficiency, so technology that was well-suited to older network systems suffered a setback when deployed in WCDMA or other next-generation platforms. Consequently, early 3G network operators saw dramatic increases in operational expenses (OpEx) due to the loss of efficiency, so they sought solutions. The more highly efficient and linear nature of HV-HBT products from TriQuint provide the right solution at the right time, said Green.

A typical RF section in a base station radio is made up of three areas known as the pre-driver, driver and output stages, the company said. The low power HBT devices released by TriQuint provide for pre-drivers and drivers. TriQuint released its first generation of HV-HBT devices in October of 2007. These products serve the driver and output stages.

The HV-HBT devices released at the IEEE IMS MTT-S Convention and Exhibition in Atlanta, GA (USA), integrate two stages into a single package. This allows designers to reduce the number of discrete amplifier components in a system, the company said. When used in a typical base station HPA design, the company said a 25 percent cost reduction and a PCB area savings of 12 square centimeters can be achieved.

((Comments on this story may be sent to newsdesk@closeupmedia.com))

((Distributed via M2 Communications Ltd - http://www.m2.com))

http://www.10meters.com

Comments on this story may be sent to newsdesk@closeupmedia.com

More News:   Market Updates | Stock Alerts | All Trading News | Stock Index