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The acquired patented innovations are key enablers for achieving high manufacturing yields in System-in-Package (SiP) implementations. SiP consists of a number of stacked integrated circuits (IC) such as a media processor, dynamic random access memory (DRAM), and flash memory device enclosed in a single package or module.
Deal Type Acquisition Sub-Category Asset Purchase Deal Status Completed: 2009-04-07
Deal Participants
Target (Company) Inapac Technology, Inc. - Patents Acquirer (Company) Rambus, Inc. Vendor (Company) Inapac Technology, Inc.
Deal Rationale
The acquisition would enable Rambus to broaden its portfolio for the mobile market. The acquired patented innovations would increase the assembly yield in System-in-Package (SiP) implementation devices.
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