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To view the Multimedia News Release, go to: http://multivu.prnewswire.com/mnr/ti/39148/
(Photo: http://www.newscom.com/cgi-bin/prnh/20010105/NEF016LOGO)
With the C6472, TI has broken the power performance barrier by fully optimizing the device for applications where performance per watt is a critical requirement. The C6472 DSP offers the lowest power consumption with the highest processing performance of any multicore DSP with the total of 3GHz performance in the market, performing at 3.7W performance and 0.15 mW/MIPS. TI's power-efficient C6472 was designed to support applications that drive many channels, demand maximum performance density and for which designers must have access to sophisticated functions. Additionally, many applications utilizing the C6472 will not require any external memory, further improving the power profile and cost effectiveness of the device. These devices are ideal for markets such as high-end industrial, test and measurement, communication, medical imaging, high-end imaging and video, and blade server. TI provides extensive support for the C6472, including an evaluation module, robust software libraries and a third-party ecosystem, to further facilitate the process of writing code that runs optimally on multicore devices. For more information on TI's C6472 high-performance multicore DSP, please visit: www.ti.com/c6472pr-wn
C6472 DSP key features and benefits:
-- Six high-speed C64X+ DSP cores running at 500MHz, 625MHz, 700MHz, and
fully backward compatible with other C64X DSP cores.
-- Up to 4.2 GHz/33600 MMACs and 4.8 MB on-chip L1/L2 RAM.
-- Offers best power efficiency in the industry with 3GHz performance at
0.15 mW/MIPS.
-- Optimized DSP architecture maximizes subsystem performance on a chip.
One of the advantages of this architecture is that in addition to
dedicated L1 and L2 memory to each core, the C6472 features 768KB shared
L2 program/data memory and a shared memory controller to facilitate high
efficient and flexible inter DSP core communications.
-- Contains rich device peripherals which include: GigaBit Ethernet, Serial
RapidIO (SRIO), DDR2, telecom serial interface port (TSIP), host port
interface (HPI), Utopia, Inter-Integrated Circuit (I2C) Bus (I2C) and
general purpose input/output (GPIO).
Developer network for the C6472:
-- Adaptive Digital Technologies (Adaptive Digital): Manufacturers
leveraging Adaptive Digital's field-proven DSP algorithms and G.PAK(TM)
framework can support applications such as high-density VoIP,
AT&T-certified G.168 echo cancellation, conferencing, and transcoding.
-- ENEA: With optimized multicore support for the TI C6472, the Enea
OSEck(R) RTOS along with the Enea LINX(R) scalable and reliable messaging
layer, plus secure IP/signaling/NGN media networking protocols delivers
exceptional reliability, performance and time-to-market acceleration.
Enea dSPEED(R) data plane management framework and Enea Optima(R)
eclipse-based system debugging tools supports comprehensive remote
management/monitoring of deployed systems and system level visualization
in the design lab.
-- RadiSys: The RadiSys Promentum(R) ATCA-9100-TI is an ATCA media
processing blade that includes two purpose-built mezzanine cards to
house up to 20 6-core TI C6472 per blade providing the highest density
of media processing through the use of the latest multicore DSP silicon
from TI for applications such as IPTV and Mobile Video/TV.
-- Sundance Multiprocessor Technologies Ltd: Sundance's EVP6472 supports
two TI C6472 multicore DSPs, closely coupled to a state-of-the-art FPGA
and is supported by 3L's Diamond RTOS and TI's CCS tools for rapid
prototyping/debugging of applications. The EVP6472 will be introduced at
USD $2,000 for a limited period and will ship in December 2009.
-- SURF: When combined with TI's C6472, SURF enables multimedia
applications by providing a leading DSP-based video & voice engine,
which includes multi-screen transcoding, video streaming, high-scale
conferencing, content enrichment, quality boosting and more.
Manufacturers leveraging SURF's comprehensive toolbox can significantly
broaden their product portfolio, enrich applications, achieve superior
QoE, shorten time-to-market and focus on creative applications and
services.
Pricing and availability:
The TMS320C6472 is available starting at USD $140 in quantities of 1K units. To help speed development, developers can take advantage of the low cost high performance evaluation module TMDXEVM6472 for USD $349.
Find out more about TI's C6472 DSP by visiting the links below:
-- C6472 Overview Page: www.ti.com/c6472pr-wn
-- C6472 Product Folder: www.ti.com/c6472pr-pf
-- C6472 EVM Folder: www.ti.com/c6472pr-evmf
-- Related White Paper: www.ti.com/c6472pr-wp
-- Dapco Customer News Release: www.ti.com/c6472-pr-customer
-- DSP Selection Tool: www.ti.com/c6472pr-dsptool
-- C6472 on E2E Community: www.ti.com/c6472pr-e2e
-- C6472 Video Overview and Demo: www.ti.com/c6472pr-v
-- Multicore microsite: www.ti.com/c6472pr-multicore
-- TI E-store: www.ti.com/c6472pr-estore
-- Follow TI on Twitter: http://bit.ly/REsI6
About Texas Instruments
Texas Instruments (NYSE: TXN | Quote | Chart | News | PowerRating) helps customers solve problems and develop new electronics that make the world smarter, healthier, safer, greener and more fun. A global semiconductor company, TI innovates through design, sales and manufacturing operations in more than 30 countries. For more information, go to www.ti.com.
Trademarks
TMS320C64x and C64x+ are trademarks of Texas Instruments. All other trademarks and registered trademarks belong to their respective owners.
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SOURCE Texas Instruments
http://www.ti.com
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