STATS ChipPAC CEO Named Asia Innovator of the Year at the CNBC Asia Business Leaders Awards -
STATS ChipPAC Reports 3Q Financials -
STATS ChipPAC Reports Third Quarter 2008 Results -
STATS ChipPAC Introduces Pre-Stacked PoP Solution -
STATS ChipPAC Offers Innovative USB Module for NAND Flash Memory Applications -
STATS ChipPAC Terminates Tender Offer and Consent Solicitation for Its Senior Notes -
STATS ChipPAC Wins Packaging Award -
STATS ChipPAC Reports Second Quarter 2008 Results -
STATS ChipPAC Extends the Tender Offer and Consent Solicitation for Its Senior Notes -
STATS ChipPAC Wins 2008 Advanced Packaging Award for New Flip Chip Package Integration Technology -
STATS ChipPAC Announces Pricing of the Tender Offer and Consent Solicitation for Its Senior Notes -
STATS ChipPAC proposed senior unsecured notes rated 'BB+' - S&P -
STATS ChipPAC Completes Full Qualification of Fan-in Package-on-Package Technology -